Have had some issues etching a logo.
I would like to etch a logo .003-.004 deep. I only seem to be able accomplish that by holding a pad to the stencil for 1 minute or so on 4.5 level. Also, just holding doesn't seem to do much - I have to 'rub' it in. So, longer holding times, and perhaps a little too much electrolyte have resulted in some electrolyte seeping around the logo and discoloring and pitting and a too much heat warped a stencil. Not very encouraging, if you think you might mess us your work in a last step.
What is a good schedule for etching to get .003-.004 deep? I was trying 30sec on 30 sec off, but the result wasn't as impressive. I will probably go just for a silver mark.